Panellist announced for CanTech The Grand Tour

Panellist announced for CanTech The Grand Tour

Following a sequence of exciting announcements relating to Asia CanTech and CanTech The Grand Tour, Saket Bhatia, senior vice president at Hindustan Tin Works, has been announced as the latest panellist for the Candid Forum at CanTech The Grand Tour in New Delhi, India in February 2020.

An experienced entrepreneur heading the sales & marketing, new product development and business strategy functions at Hindustan Tin Works, Bhatia is a key member of the Hindustan Tin Works organisation. Presently he is a management committee member of IIP (Indian Institute of Packaging – Northern Region), the past chairman of marketing committee of IPA (International Packaging Association), and the past chairman of the packaging committee of All India Food Processors Association.

“It’s an excellent initiative to bring CanTech The Grand Tour to India,” said Bhatia. “We have been trying to persuade the CanTech team for a while to consider India as a trade show destination, bearing in mind India is one of the fastest growing economies in the world.

“With the recent sustainability and environmental issues faced globally due to packaging waste, it gives us an opportunity to position metal packaging in the right space by creating awareness through this global conference.

“As a company we have been part of the CanTech for many years at an editorial board level, we look forward to assisting at the event which is happening in the first time in India.

“We wish Bell Publishing all the best for the event.”

CanTech The Grand Tour is a conference for metal packaging manufacturers from across the globe. The conference assembles technical experts from global suppliers and their customers, maximising the channels of communication between key decision makers in the metal packaging industry and providing can makers with access to the latest in efficient and flexible production technologies.

The event takes place 17-19 February 2020 in New Delhi, India.